Electroplating Process Engineer
Position Summary:
SkyWater Technology is seeking a Plating Process Development Engineer to take responsibility for establishing and managing electroplating and metal wet etch processes at our Florida Advanced Packaging facility. In this position, you will focus on developing and enhancing processes for integrated Advanced Packaging process sequences and cutting-edge Heterogeneous Integration (HI) platform technologies. These include Hybrid Bonding, Direct Bond Interconnect (DBI), 2.5D and 3D Interposer technologies, as well as Fan-Out Wafer Level Packaging (FOWLP). Join us in driving innovation within the US electronics industry.
Responsibilities:
• New process development and transfer in a manufacturing environment.
• Develop robust manufacturable process recipes for Foundry customers in Electroplating (copper, nickel, SnAg, Au) and associated metrology.
• Develop wet etch processes for seed layer strip and etch-back processes
• Work on a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
• Utilize metrology tools to characterize and document process results for transfer to production.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process integration and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes.
• Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.
The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications:
- U.S. Person Required: SkyWater Technology Foundry, Inc. subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.
- Education: BS Engineering, MS/PhD preferred. Physics, Chemistry, Chemical Engineering, Electrical Engineering, Materials Science, or equivalent.
- Back-end-of-line (BEOL) or front-end-of-line (FEOL) Fab processing tools knowledge/experience in electroplating and associated metrology.
- MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree. 2 years experience required with BS.
- Knowledge of DOE, SPC, and 6-sigma concepts and applications.
- Project Management skills and/or defined training a plus.
- Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
- Can work both independently and in cross-functional teams for problem solving.
Other details
- Job Family Engineering
- Pay Type Salary
- 200 NeoCity Wy, Kissimmee, FL 34744, USA